Unified Liquid Cooling Heat Solution

The objective of this Senior Design project is to design a thermal management system for a multi-kilowatt, multi-phase, power converter based around a unified thermal core with liquid cooling. This will require that the semiconductor transistor dies to be removed from the normal packaging found in a commercial device to maximize heat transfer to the thermal core and into the coolant. We will adapt a heat sink to the newly configured shape and use math models and simulation to fine the optimum design. After completion of this modeling we will be manufacturing a sink and then using experimental methods to determine the best option for our Heat sink to properly manage the systems waist heat as efficiently as possible.

Problem Statement
The objective of this Senior Design project is to design a thermal management system for a multi-kilowatt, multi-phase, power converter based around a unified thermal core with liquid cooling. –Rachel Peterson

The first phase of the process will be designing a heat sink to fit within the constraints for the thermal and physical properties defined by board configuration and MOSFET placement.

The second phase will be focused around testing for the purpose of refining heat dissipation, functionality, and efficiency.

Project Goals
Our Project Goals are to Complete a robust heat removal system to fit within the constraints required by the project. We will design the heat sink to be able attach securely to the MOSFETS with a pressure of at least 10 PSI.The current goal is to explore natural convection if this is not feasible forced convection will be explored. We hope to be able to manufacture the Heat sink in house, but will evaluate all options. In addition we will preform tests and gather on the various sinks both as simulation and in an experimental capacity, with the aim of finding the optimum solution.

Heat Sink CAD Design
We began my making various solidmodels of our heat sink based on the mechanical specifications. We ended up with 4 basic models which we presented at the Snapshot day. We tried to maximize the surface are of the heat sink while deceasing the weight and making it machinable. Currently two of these models, the triangular design and crossed fin design, are being simulated as potential candidates. If favorable data is found then machining will begin on each model.

Heat Sink Math Modeling and Simulations
We began by creating models to determine how much heat the sinks would need to draw as well as how air would flow through them. Grad student Rachel Peterson has been modeling these designs and helping us determine there eligibility as working heat sinks.

Experimental Designs
For our experimentation we plan to a combination of thermocouples and thermal imaging cameras to best test how well the Heat sink operates within the system. We plan to encase the the board and sink and using a controlled environment model how well each Heat sink works.

Document Archive
Documents (Schedule, Meeting Minutes, Presentations,ect)