Solder Joint Reliability

Solder Joint Reliability
The solder joint reliability study will help indicate which solder type provides the best mechanical strength to a system of electrical components after a series of repeated thermal cycles.

Sponsors
This Capstone design project is sponsored by the Micron Foundation.

Problem Statement
The focus of the project will aim towards validating the solder joint bond strength at a point between a printed circuit board (PCB) and the electronic package that would be mounted to it. Using the known strengths of the materials, performing a thermal cycle testing sequence, and measuring the force required to break the solder joint bonds will predict which solder type performs the best in electronic packaging. This will allow future electronic packages to have a longer lifespan and will reduce costs to manufacturers.

Design Goals
The goal of our design project is to design a realistic finite element simulation of a Hybrid Memory Cube(HMC) device. This simulation will illustrate where fatigue and creep properties of the solder propegate cracks within solder joints that fix the HMC to the printed circuit board(PCB).

Design Specifications
To achieve a realistic model of a HMC we will establish material properties for the specific solder composition, and PCB surface finish used and enter our data into the computer simulation program Abaqus.