SEL Thermal Card Guide

The goal of this project is to develop a card guide design that can be applied in SEL equipment that has a net thermal resistance less than 1 ⁰C/Watt between an aluminum tray (.05"-.1" thick) and the chassis (.05"-.1" thick). This involves creating an instrumented test stand for measuring heat transfer across the card guide. Results should be reconciled against an analytical model to assure accuracy. The recommended solution should meet SEL standards for vibration.

Background
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Deliverables
Mathematical heat transfer model Experimental test set-up that can accommodate different guide configurations Experiment design and test results that demonstrate which guide configurations are most effective Comprehensive project documentation for easy future reference by client

Specifications
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Project Learning
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Thermal Modeling
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Test Setup
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Team Information
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